In an attempt to get the lead out, three semiconductor manufacturers
announced plans to reduce the amount of heavy metal in their chips by as
much as 95 percent.
Prompted by U.S. and European regulations, Silicon Valley-based Intel,
AMD,
and National Semiconductor
all announced separate plans this week to alter product packaging
with combinations of tin/silver/copper alloys in order to make it more
environmentally friendly. Computer makers use lead in the soldering of
printed circuit boards and other electronic components as well as in the
glass panels in CRT (cathode ray tubes) computer monitors.
While there are no direct exposure dangers while the computers are in
use, lead accumulates in the environment and has high acute and chronic
toxic effects on children, plants, animals and microorganisms. According to
the Silicon Valley Toxic Coalition, by 2004 more than 315 million computers
will become obsolete is the USA. This adds up to about 1.2 billion pounds of
lead. The danger is even greater overseas where dumping laws are improving
but less strict.
Intel said it shipped its first lead-free memory chips last year and
would begin shipping the lead-free technology with select microprocessors
and chipsets in the second half of this year and its embedded processors by
the end of June. The new packages are expected to use lead-free solder
balls, about the size of salt crystals, and represent the majority of lead
used in Intel microprocessor packaging. Intel is working with the industry
to find an alternative solution for the tiny amount of lead still needed
inside the processor packaging to connect the actual silicon “core” to the
package.
In the meantime, Intel said it would continue to ship processors with the
current packaging during the transition period to help out system
manufacturers who need time to develop and qualify their lead-free processes
and products.
Separately, National Semi said it wants to replace approximately five
tons of lead it uses in a year to build its integrated circuit (IC)
products. The company said it would also look at cutting out as much bromine
and antimony-based flame-retardants in its chips as possible. Both processes
should be complete by the end of the year.
Currently, 90 percent of National’s portfolio of 15,000 analog and
mixed-signal ICs are lead-free package types. The company said it used use
lead in the finish of copper lead frame-based packages. It was also used in
the solder balls of array packages such as Micro SMD, PBGA and FBGA
packages. National said it would replace the lead in lead frame packages
with a matte tin finish, and in the solder balls with a tin-silver-copper
alloy.
AMD said it is participating in the European Community’s July 1, 2006
phase-out deadline for lead in electronic products, with some exceptions. The
company already has initiated a lead-free research and development program,
and is working with suppliers and other companies to establish lead-free
standards and testing requirements and to identify possible substitutes.
As part of its latest “Spansion” Flash memory family release,
AMD in cooperation with Fujitsu has announced its S29AL/GLxxxM device family
for embedded applications. The product line is offering lead-free packaging,
which the company said contain less than 0.1 percent total weight of lead,
to reduce environmental impact and help compliance efforts with
international regulations.
